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Microchip Hailo 15L


The Hailo-15L™ AI vision processor is a cost- and power-efficient system-on-chip (SoC) for mass-market and high-volume smart cameras. It integrates Hailo's patented, field-proven AI inference technology, with a 7 TOPS neural network core, together with a state-of-the-art computer vision subsystem and AI-powered ISP, bringing top image quality and advanced AI analytics to more cameras at an attractive cost.

The 7 TOPS NN core runs AI image enhancement, such as low-light denoising, concurrently with AI analytics pipelines, and enables generative AI applications on the camera, such as free-text video search, indexing and event triggering. A quad-core Arm Cortex-A53 application processor, a vector DSP, an ISP with premium 4K30 image quality and H.265/H.264 video encoding complete the camera SoC. Its low power consumption fits Type 1 (Class 2) PoE cameras.

Hailo-15L is supported by the Hailo Vision Processor Software Package, a complete Yocto-based Linux distribution with camera drivers, the Hailo Media Library and image and video processing libraries, and by the Hailo AI Software Suite for compiling and deploying neural networks. The same software package supports the entire Hailo-15 family, from 7 to 20 TOPS. It is available in industrial grade (-40°C to +85°C).


  • Cost-Efficient AI Performance in a Camera SoC:

  • 7 TOPS neural network core running multiple AI models in parallel

  • Concurrent AI image enhancement and AI analytics pipelines

  • Generative AI on the camera, such as free-text video search, indexing and event triggering

  • Competitive BoM cost with low DRAM requirements

  • Superior Image Quality:

  • Premium 4K30 image quality, with ISP and video encoding up to 4K60

  • AI-ISP for low-light denoising and color preservation in day and night conditions

  • High Dynamic Range (HDR) with up to 3-exposure merging, WDR, and multi-stage noise reduction (2DNR, 3DNR, chroma NR)

  • Electronic image stabilization, lens shading and distortion correction, de-warp, digital zoom, flip and rotate

  • Video and Vision Processing:

  • H.265/HEVC and H.264/AVC encoding, multiple streams

  • Vector DSP with 256 MACs @ 750 MHz (up to 380 GOPS)

  • MIPI CSI-2 (4-lane, or two cameras over 2 lanes each) and DVP 24-bit inputs; MIPI DSI 4-lane output

  • Low Power:

  • Low power consumption (actual power consumption is workload dependent), compatible with Type 1 (Class 2) PoE cameras, or Class 3 for complex AI pipelines

  • Application Processor and Memory:

  • Quad-core Arm® Cortex®-A53 @ 1.1 GHz (10.1 kDMIPS) running Yocto-based Linux

  • Dual Arm® Cortex®-M4 @ 200 MHz for system control

  • LPDDR4/4X 32-bit up to 4266 MT/s

  • Flash controller: SPI/DSPI/QSPI, up to 4 devices; SDIO 3.0 / eMMC 5.1 (up to HS200)

  • Connectivity:

  • PCI Express® Gen3 x2 (Endpoint or Root Complex)

  • 10/100/1000 Mbps Ethernet (RMII/RGMII)

  • USB 3.1 Gen2 Host/Device and USB 2.0 Host

  • Two CAN controllers, four UARTs, four SPI, four I2C, two I2S controllers, six PWMs, 32 GPIOs, 16-channel DMA

  • Security:

  • Secure boot and secure debug

  • Hardware-accelerated crypto library

  • Arm® TrustZone®, TRNG and firewall

  • Comprehensive Software:

  • Hailo Vision Processor Software Package: Hailo OS (Yocto-based Linux), Hailo Media Library, Hailo Imaging, HailoDSP and Hailo Camera Applications

  • Out-of-the-box camera pipelines, such as 4K30 Dynamic Privacy Mask, with open software for camera vendors to build their own

  • Hailo AI Software Suite for compiling and deploying neural networks, with the Hailo Model Zoo

  • Industrial Grade:

  • Industrial: -40°C to +85°C, for indoor and outdoor installation

  • 361-pin LFBGA, 13 x 13 mm, 0.65 mm pitch


  • AI Performance (TOPS)::7

  • CPU::Quad-core Arm Cortex-A53

  • CPU Speed Max MHz (megahertz)::1100

  • ISP::4K30 premium image quality (up to 4K60); HDR, AI-ISP

  • Video Encoder::H.265/HEVC, H.264/AVC, up to 4K60, multi-stream

  • Power (W)::3.2 in 4K AI camera use case (workload dependent)

  • Camera Interface::MIPI CSI-2 (4-lane or 2x 2-lane), DVP 24-bit

  • Graphic LCD Interface::MIPI DSI (4-lane)

  • DSP::Vector DSP, 256 MACs @ 750 MHz (380 GOPS)

  • MCU::2x Arm Cortex-M4 @ 200 MHz

  • Ext. DRAM Interface::LPDDR4/4X

  • Ext. DRAM Bus::32

  • SDIO/SD-CARD/eMMC::2

  • QSPI::Yes (SPI/DSPI/QSPI, up to 4 devices)

  • PCIe::Gen3 x2 (Endpoint or Root Complex)

  • 10/100/1000 Ethernet MAC::1 (RMII/RGMII)

  • USB Interface::USB 3.1 Gen2 Host/Device, USB 2.0 Host

  • CAN/CAN-FD::2

  • U(S)ART::4

  • SPI::4 (3 master, 1 slave)

  • I2C::4

  • I2S::2 controllers (2 RX/2 TX and 1 RX/1 TX)

  • PWM::6

  • I/O Pins Max::32 (GPIO)

  • Crypto Engine::Yes

  • Secure Bootloader::Yes

  • Arm TrustZone::Yes

  • TempRange Min::-40

  • TempRange Max::85

  • Pincount::361

  • Packages::LFBGA

  • Package Size (mm)::13 x 13


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